Sonim partners with FIH Mobile to produce rugged feature phones – Telecompaper

Sonim Technologies has selected FIH Mobile (FIH), a subsidiary of Foxconn Technology Group, to support the engineering and manufacturing of Sonim’s next generation feature phones. These future devices are expected to leverage Qualcomm chipsets and rugged phone characteristics. Sonim expects to benefit from FIH’s integrated original device manufacturer (ODM) services including hardware, software, certification and manufacturing. In addition, working with FIH will provide Sonim wotj access to a supply chain and manufacturing process. The first devices are expected to come to market in Q3.

Source: Sonim partners with FIH Mobile to produce rugged feature phones – Telecompaper

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